With the objective to organize a Future Ready Packaging Conclave focusing on Sustainable Packaging, its technology, opportunities in branding via Packaging and to include all the stakeholders in the overall value chain of the entire industry, the Bengal Chamber of Commerce and Industry organized its first ever Packaging Conclave on a virtual mode. The BCC&I Packaging e-Conclave was held on 20th August 2021 and discussed the following topics: 

• Aligning Apt Policy for Sustainable Packaging in India: Mapping the future Demand
• Sustainable Packaging: Blending technology cocktail with optimization & efficiency
• Branding via Packaging: If look could kill and content could connect
• The Stakeholders' Perspective of the Industry. 

The Packaging e-Conclave witnessed a lively discussion between Industry Stalwarts. They discussed, that in recent times, Consumer expectations are becoming increasingly high, and industries across the spectrum are upgrading their products and systems to become smarter, and provide exceptional customer experience. There has been a boom in the e-commerce and the organized retail sectors in India, with the manifold increase of packaged food consumption, awareness and a demand for quality products. This, in turn, has seen a tremendous growth in packaging innovations across the country. Brands are catching up to the trend by using innovative packaging solutions to enhance consumers’ experience and increase the shelf appeal of their products. This e-Conclave tooka closer look at the various trends, technologies and developments taking place in the Indian packaging market. Latest technologies in the packaging space like nanotechnology is gaining popularity in several areas of food sciences such as food safety, packaging, processing, bio-availability, fortification, encapsulation among others. With packaging, sustainability is another driver which plays a huge role in influencing companies and consumers to find innovative recycling technologies for greener, more environmentally friendly solutions. The global consensus to reduce negative environmental effects of packaging in conjunction with technological innovations have driven brands to reduce material usage, use recyclable material in packaging, increase recycling plants and develop the use of other sustainable materials. 

The E-Conclave witnessed the presence of Industry Stalwarts like Mr. Saket Kanoria, MD, TCPL Packaging ltd., MrJeevaraj Pillai, Joint President - Packaging & New Product Development, UFLEX Ltd, Mr. Robin Banerjee, MD & CEO, Caprihans India Ltd. & Mr. Pankaj Poddar, CEO, Cosmo Films. 

Mr. Madhab Chakraborty, Joint Director & Regional Head, Indian Institute of Packaging (Delhi Centre) was the Guest of Honourand Prof. Prasad Balan Iyer, Director, SIES School Of Packaging contributed immensely on the discussion on packaging technology. 

The session on Stakeholders’ Perspective witnessed the participation of Haldia Petrochemicals Ltd, Indian Oil Corporation Ltd., & HPCL-Mittal Energy Limited, all of whom are producers of Polymer, an important raw material of the plastic packaging industry. Mr. Rakesh Shah, Former Managing Director at  Windmoller&Holscher India Pvt. ltd. &  Founder and Consultant, Probity Consultants spoke on the supplies of Indian Packaging Machineries. 

Mr. Dhananjay Salunkhe, Chief Executive, Packaging & Printing Business, ITC Ltd. elaborated on the fact that packaging is an important aspect of branding and how it influences branding. 

Mr. Sumit Gupta, Managing Director and Partner, BCG & Conclave Chairman, BCC&I Packaging e-Conclave and Mr. Ronojoy Basu, Area Sales Manager, Middle East & South East Asia, Emerson + Renwick Group & Conclave Co- Chairman, BCC&I Packaging e-Conclave moderated the sessions extremely well which gave a fine direction to the Conclave with their well framed question addressing the issues of the sector. 

The Conclave was a big success which received more than 50,000 viewers and a very positive response from the industry expressing the demand of a repetition of the Conclave on a larger scale.